If you are developing a power electronics product — an EV charger, a battery management system, a solar inverter, or a high-power converter — you already know that finding a design partner who genuinely understands the hardware is not straightforward. Circuit Brilliance was built for exactly that gap. Every case study on this page represents a complete design engagement — schematic, simulation, PCB layout, and documentation — executed with the same structured methodology we bring to every client project.
SiC MOSFET | 400V Bus | Dual Active Bridge + Active PFC | >96% Efficiency
If your product needs bidirectional power flow, Vehicle-to-Grid capability, or high-efficiency EV charging at the 400V bus level — this design covers exactly that ground.
Dual Active Bridge (DAB) topology — phase shift modulation for bidirectional power flow
Active PFC front end — unity power factor, full grid compliance
SiC MOSFET full bridge — high frequency operation with low switching loss
High frequency isolation transformer — custom design with interleaved windings
CAN bus communication — SOC feedback and charge control interface
Insulation coordination for 400V bus verified at schematic and PCB level.
Full loss budget scan across SiC conduction, switching, magnetics, and gate drive.
Critical failure mode analysis for bridge shoot-through and over-voltage scenarios addressed.
Thermal stress and multi-layer copper pour strategy validated for SiC device heat dissipation.
Gate drive commutation loop inductance minimized; high-frequency parasitic assessment complete.
Nine-stage PCB execution from layout intelligence extraction to Gerber package.
Schematic : full system
PSpice Simulation : switching waveforms, efficiency curve, thermal stress, load transient
PCB Layout : high voltage compliant, thermally managed, EMI-conscious, DFM verified
Documentation : design calculations, component rationale, compliance notes, test plan
Demonstrating full domain breadth — these designs are currently in preparation to showcase our complete engineering capability across the power electronics landscape.
Mixed Signal | Distributed 96S Architecture | 350V Bus | 20kW
IGBT Modules | Three-Phase Full Bridge + LCL Filter | 700V DC Bus | 15kW
GaN HEMT | Three-Level Vienna Topology | 800V DC Output | 7kW
