Six Proprietary Analytical Pillars
Our design process is built on six independent analytical pillars — ensuring that every engineering decision is validated against international standards, physical phenomena, and failure mode libraries.
Standards Compliance Checklist
"Find the compliance gap at the design stage — not at the certification stage."
A structured audit framework evaluating PCB design and documentation against applicable international standards covering PCB design, insulation coordination, reliability prediction, and product safety. Clause-level traceability. Cross-standard conflict identification.
- Compliance status across applicable international standards
- Clause-level findings traceable to specific standard and section
- Cross-standard conflict identification
Thermal Analysis Framework
"Every degree above junction limit is a reliability debt — CB-Thermal finds it before it compounds."
Complete junction-to-ambient thermal chain analysis. Maps every Rth node per heat-generating component. Identifies hotspot risks, validates thermal via arrays, estimates worst-case junction temperatures.
- Full junction-to-ambient Rth chain per heat-generating component
- Hotspot risk assessment — placement, copper spreading, power density
- Worst-case junction temperature estimates at full load and maximum ambient
Loss Budget Framework
"Fight for the Fractions — efficiency is won or lost in the decimals."
Full-spectrum loss analysis framework. Every watt of loss has an address — CB-LBF locates each one across conduction, switching, magnetics, gate drive, and PCB parasitics. Scanner Principle: no verdicts, pure visibility.
- Full-spectrum loss scan — every mechanism identified and quantified
- Itemised loss register per mechanism and per operating point
- Scanner Principle report — verdict-free, engineered for the team to act on
Gap Analysis Framework
"Circuit Brilliance operates where the standards stop — and the engineering begins."
Maps the boundary between auditable standards and 18 years of engineering judgement. Identifies physical phenomena that standards often miss across all four domains.
Failure Mode & Effects Analysis
"Generic FMEA finds generic failures. CB-FMEA finds the ones that take down your board."
Two-tier, power-electronics-specific FMEA framework. Tier 1 maps failure propagation paths across the full system. Tier 2 scores failure mode severity at component level.
- System-level failure propagation map (Tier 1)
- Component-level risk register (Tier 2) — SOD scores and RPN rankings
- Structured report for design reviews and audits
Comprehensive Review and Assured Fabrication Technology
"CB-CRAFT reflects the design as implemented. It does not pass or fail. It observes, records, and verifies."
CB-CRAFT is Circuit Brilliance's PCB Design Execution Framework — the stage where every upstream framework output (SCC, LBF, Thermal, GAF, FMEA) converges into a verified, manufacturable PCB deliverable.
Nine-Stage Execution Flow
Reading the schematic for layout-critical information.
Mechanical constraints, surface finish, layer budget.
Isolation, copper weight, and design rule implementation.
Switching loops, gate drive proximity, thermal zone compliance.
Power trace sizing, Kelvin sense routing, ground zone discipline.
Design for Manufacturability and Assembly verification.
Test points, programming access, serviceability.
Creepage, clearance, isolation, safety marking.
Final package generation, ODB++, and manufacturing release.
CB-CRAFT does not determine requirements — it verifies their implementation. CB-SCC determines compliance requirements — CB-CRAFT checks the PCB delivers them. CB-LBF determines current values — CB-CRAFT sizes the copper to carry them. CB-Thermal determines thermal zones — CB-CRAFT verifies placement honours them.
every checkpoint reviewed across all nine stages, observations recorded
one-page confirmation the design underwent CB-CRAFT review
switching loop area, isolation strategy, copper weight rationale
fabrication-ready files verified under CB-CRAFT before release